No Items SPEC
1 Trace Width/Space 35μm /35μm
2 Trace Width Tolerance ±10%
3 Distance between Pad and Conductor 0.075mm
4 Distance between Board Edge and Conductor 0.15mm
5 Min. Pad Size 0.2*0.2mm
6 PTH Pad Size 0.25mm
7 Min. PTH Aperture 0.05mm
8 Registration of Silk-Screen ±0.075mm
9 Tolerance of External Dimension ±0.05mm
10 Tolerance of Aperture ±0.015mm
11 Registration of Hole ±0.025mm
12 Thickness of Ni Plating 1μm-5μm
13 Thickness of Au Plating 0.05μm-0.2μm
14 Maximum Layer 8 Layers



项目 量产能力
Chip器件 可加工最小尺寸电阻、电容电感 0201
SMT加工直通率 99.95%
米乐娱乐 可加工最小Pitch 米乐娱乐 0.4mm
SMT加工直通率 99.80%
BGA 可加工最小Pitch BGA器件 0.4mm
SMT加工直通率 99.80%
QFN 可加工最小Pitch QFN器件 0.4mm
SMT加工直通率 99.80%
LED LED灯贴装角度精度 ±1°
SMT加工直通率 99.90%